一种高速化学镀Ni-Cu-P合金工艺

开发一种高速化学镀Ni-Cu-P合金工艺，研究了镀液中CuSO4·5H2O浓度、pH值及温度对镀层成分、镀速的影响，并根据GB10124-88对镀层作了耐蚀性试验。结果表明，本工艺在各参数较大的变化范围内均可获得较高的镀速，最高镀速可达28μm／h，而且镀层具有较好的耐蚀性，该工艺条件下获得的镀层在50％H2SO4（室温）和50％NaOH（95℃）中的耐蚀性远高于1Cr18Ni9Ti、1Cr18Ni12Mo2Ti等不锈钢、碳钢以及Ni-P化学镀层。

A High-Speed Eleetroless Ni-Cu-P Alloy Process

A high-speed electroless Ni-Cu-P alloy process was developed.The influences of the concentrations of CuSO4·2H2O in the liquid, the pH value, and the temperature of the liquid on the composition of the electroless plating and the electroless speed were studied,and a corrosion resistant test was made based on the standard of GB10124-88. The result shows that this process could obtain higher ebectroless speed in the range of the parameters with larger changes,the highest speed reached up to 28 μm／h. The electroless plating possessed better corrosion resistant performance.The corrosion resistance of the electroless plating obtained in the process was much better than that of 1Cr18Ni9Ti,1Cr18Ni12Mo2Ti, carbon steel, and the Ni-P electroless plating in 50% H2SO4 (room temperature) and 50% NaOH(95℃).