| 国内半导体封装清模材料的最新进展及趋势 |
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| 引用本文： | 霍炬.国内半导体封装清模材料的最新进展及趋势[J].电子与封装,2006,6(1):3-7. |
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| 作者姓名： | 霍炬 |
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| 作者单位： | 天津大学管理学院,天津,300072 |
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| 摘 要： | 封装模具的清洗对于半导体封装企业而言是一项重要的养护工作。而清模材料的选用不单单关系到产品的品质,也关系到生产效率和成本。文章针对两种主要的清模材料三聚氰胺清模料和清模胶条,分别从技术和市场的角度,比较它们的特点,同时分析其目前的应用状况,以及最近进展和未来的发展趋势。
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| 关 键 词： | 清模材料 三聚氰胺 清模胶片 环氧树脂塑封料 转移成型 |
| 文章编号： | 1681-1070（2006）01-03-05 |
| 收稿时间： | 2005-11-10 |
| 修稿时间： | 2005年11月10 |
The Latest Status and Trend of Molding Die Cleaning Materials of China Semiconductor Assembly Industry |
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| Huo Ju.The Latest Status and Trend of Molding Die Cleaning Materials of China Semiconductor Assembly Industry[J].Electronics & Packaging,2006,6(1):3-7. |
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| Authors: | Huo Ju |
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| Affiliation: | The Management School of Tianjin University, Tianjin 300072, China |
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| Abstract: | It's an important maintaining activity to clean molding die for semiconductor assembly factories. Not only the quality but also the production efficiency and cost are effected by choosing a suitable cleaning material. With comparing the performances and characteristics of the main two cleaning materials, Melamine compound and rubber cleaning sheet, and upon the views of technology and market respectively, the basic concepts, current application status, latest progress and developing trend are introduced in this paper. |
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| Keywords: | Cleaning Material Melamine Rubber Cleaning Sheet Epoxy Molding Compound Transfer Molding |
| 本文献已被 CNKI 维普 万方数据 等数据库收录！ |
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