纳米晶CuCr触头材料的制备及性能 |
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引用本文: | 王亚平 赵峰. 纳米晶CuCr触头材料的制备及性能[J]. 兵器材料科学与工程, 1998, 21(3): 9-12,55 |
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作者姓名: | 王亚平 赵峰 |
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作者单位: | 西安交通大学 |
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摘 要: | 采用高能球磨Cu-Cr粉并在真空中缓慢热压的方法制备了纳米晶CuCr触头材料。实验结果表明,这种CuCr材料的晶粒尺寸为几十纳米,密度达到90%,在真空间隙中的耐电压强度接近常规致密、低氧CuCr触头材料的水平。
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关 键 词: | 高能球磨 纳米材料 耐电压强度 |
PREPARATION AND PROPERTIES OF CuCr CONTACT MATERIALS WITH NANOMETER GRAINS |
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Abstract: | The nanocrystalline CuCr contact materials were prepared in vacuum by heat-pressing Cu-Cr alloying powers made from high energy milling. Experimental results show that the average size of grain is about several decades nanometers and the relative density is in excess of 90% for this kind of CuCr materials. The dielectric strength in a vacuum gap approaches to the standard of ordinary CuCr contact materials. |
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Keywords: | high energy mill nanometer materials dielectric strength |
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