An experimental study on three dimensional heat transfer characteristics of simulated electronic chips

Naphthalene sublimation technique is employed to investigate three dimensional heat transfer characteristics of the simulated electronic chips. Experiments are performed for a single chip and chip arrays. In case of a single chip, local heat transfer coefficients on four surfaces of the chip are measured for various gap sizes and air velocities. Dramatic change of local heat transfer is seen on each surface of the chip, and gap size between chip and base plate is found to affect heat transfer significantly. In case of chip arrays, heat transfer characteristics from two-dimensional array of rectangular modules and three-dimensional array of hexahedral modules are investigated. Chip location, gap between chip and base plate and streamwise chip without gap. Fully developed behavior is found from the third row, but it slightly depends on flow conditions. Local and average heat transfer coefficients of three-dimensional modules are a little bit greater than those of two-dimensional modules. The differences in magnitude decrease as the longitudinal chip spacing decreases.