| 基于System C的多处理器片上系统软硬件协同仿真 |
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| 引用本文： | 吴伟,朱樟明. 基于System C的多处理器片上系统软硬件协同仿真[J]. 电子质量, 2004, 0(8): 60-62,84 |
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| 作者姓名： | 吴伟 朱樟明 |
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| 作者单位： | 西安电子科技大学微电子研究所,西安,710071;西安电子科技大学微电子研究所,西安,710071 |
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| 摘 要： | 给出了基于SystemC的处理器片上系统(System On a Chip)的协同仿真的两种方法.并通过对系统的仿真,对两个方法进行了对比,给出了在仿真间隔时间、速度和其他性能之间的比较.对目前SOC的软硬件协同设计验证有一定的实际意义.
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| 关 键 词： | 指令集仿真器 片上系统 软硬件协同设计和仿真 System C |
| 文章编号： | 1003-0107(2004)08-0060-03 |
HW/SW Co-Simulation of Mutli-Processor Systems-on-Chip Based on System C Platform |
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| Wu Wei,Zhu Zhang-Ming. HW/SW Co-Simulation of Mutli-Processor Systems-on-Chip Based on System C Platform[J]. Electronics Quality, 2004, 0(8): 60-62,84 |
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| Authors: | Wu Wei Zhu Zhang-Ming |
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| Abstract: | C can be chosen to describe both hardware and Software throughout the Whole design flow to support Hw/sw Co-design and co-simulation. Two of the proposed methodologies are used for multi-processors SOC co-simulation, which based on System C. By co-simulation on the system, We compare these two methods and provide different degrees of tradeoff between simulation granularity, speed and other performances. It is usefull for hardware/software co-design of SOC. |
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| Keywords: | System C |
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