| 多层陶瓷电容器的技术现状及未来发展趋势 |
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| 引用本文： | 王俊波.多层陶瓷电容器的技术现状及未来发展趋势[J].绝缘材料,2008,41(3):30-33. |
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| 作者姓名： | 王俊波 |
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| 作者单位： | 西安交通大学,电力设备电气绝缘国家重点实验室,西安710049 |
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| 摘 要： | 重点介绍了片式多层陶瓷电容器(MLCC)的技术现状,综述了多层陶瓷电容器(MLCC)的小型化、高容量、贱金属化及环保化的发展趋势。
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| 关 键 词： | MLCC 技术现状 发展趋势 |
The Research Situation and Development Tendency of MLCC |
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| WANG Jun-bo.The Research Situation and Development Tendency of MLCC[J].Insulating Materials,2008,41(3):30-33. |
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| Authors: | WANG Jun-bo |
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| Abstract: | The development tendency of MLCC regarding its miniature,high capacitance,base metal electrode,environmental protection were introduced,and especially the technology status of MLCC. |
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| Keywords: | multilayer ceramic capacitor(MLCC) technology status development tendency |
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