| 化学机械抛光技术研究现状及进展 |
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| 引用本文： | 董伟. 化学机械抛光技术研究现状及进展[J]. 制造技术与机床, 2012, 0(7): 93-97 |
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| 作者姓名： | 董伟 |
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| 作者单位： | 广东技术师范学院天河学院,广东广州,510540 |
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| 摘 要： | 通过回顾化学机械抛光技术的发展历史,概述化学机械抛光技术的实际应用情况,着重阐述了化学机械抛光技术的作用机理、主要构件(抛光机、抛光垫、抛光液)以及抛光工艺参数对加工过程的影响,进一步展望了化学机械抛光技术的发展前景与研究方向。
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| 关 键 词： | 化学机械抛光 研究现状 研究进展 |
The current research situation and development of chemical mechanical polishing |
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| DONG Wei. The current research situation and development of chemical mechanical polishing[J]. Manufacturing Technology & Machine Tool, 2012, 0(7): 93-97 |
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| Authors: | DONG Wei |
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| Affiliation: | DONG Wei(Tianhe College of Guangdong Polytechnic Normal University,Guangzhou 510540,CHN) |
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| Abstract: | This paper reviews the CMP technology development history,outlines CMP technology application,and emphatically illustrates the role of CMP technology.Then the paper reviews the mechanism of polishing machine,polishing pad,polishing slurries and polishing process parameters,which are the major component on the influence of processing.At last the paper predicts the development foreground and research direction of the CMP technology. |
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| Keywords: | Chemical Mechanical Polishing Research Situations Research Developments |
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