| 真空低温下螺钉压紧的Cu-Cu界面间接触热阻的实验研究 |
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| 引用本文： | 徐圣亚,洪国同.真空低温下螺钉压紧的Cu-Cu界面间接触热阻的实验研究[J].真空与低温,2010,16(3):153-156. |
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| 作者姓名： | 徐圣亚 洪国同 |
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| 作者单位： | [1]中国科学院理化技术研究所,北京100190 [2]中国科学院研究生院,北京100049 |
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| 摘 要： | 为满足航天器热控设计的需要,实验测量了真空条件下接触面温度110 K时螺钉压接的Cu-Cu界面间的接触热阻,比较了不同的螺钉预紧力矩以及不同的导热填料对接触热阻的影响。实验数据表明,界面接触热阻随着螺钉预紧力矩增大成一阶指数衰减,导热填料为铟箔时界面热阻显著的减小,接触热阻最低可以达到2.0×10-5K.m2/W。
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| 关 键 词： | 接触热阻 螺钉连接 导热填料 一阶指数衰减 |
TEST ANANLYSIS OF THERMAL CONTACT RESISTANCE OF SCREWED COPPER TO COPPER JOINTS AT LOW TEMPERATURE IN VACUUM |
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| XU Sheng-ya,HONG Guo-tong.TEST ANANLYSIS OF THERMAL CONTACT RESISTANCE OF SCREWED COPPER TO COPPER JOINTS AT LOW TEMPERATURE IN VACUUM[J].Vacuum and Cryogenics,2010,16(3):153-156. |
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| Authors: | XU Sheng-ya HONG Guo-tong |
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| Affiliation: | XU Sheng-ya ,HONG Guo--tong (1.Technical Institute of Physics and chemistry of CAS,Beijng 100190,China; 2. Graduate University of Chinese Academy of Scienses, BeUing 100049,China) |
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| Abstract: | In need of the design of the spacecraft thermal control, thermal contact resistance （TCR） of copper to copper joints has been measured in vacuum, when the interracial temperature is 110 K. The influence of different screw preload torque and different thermal conductance fillers to the TCR has been compared. The experimental data indicated that the TCR decreases by the first order exponential decay while the screw preload torque increases, the indium foils exhibits the best performance to degrade the TCR, the lowest value of TCR can be 2.0x10-5 K·m2/W. |
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| Keywords: | thermal contact resistance screw-jointed thermal conductance fillers the first order exponential decay |
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