微波倒装焊互连技术及特性分析

随着应用频率的提高，微波芯片与基板间的互连更多地采用了倒装焊。文中用HFSS（高频结构仿真器）有限元软件对凸点变换及倒装互连结构进行建模、仿真和优化，提取了凸点变换的等效集总电路模型，介绍了凸点制作工艺和倒装焊结构互连的微组装过程，并完成了试验样品的测试。最后，对微波倒装焊的前景进行了展望。

Interconnecting Technologies and Characteristic Analysis of Microwave Flip-chip Bonging

As the increasing of application frequence,the flip-chip bonging are more used as the interconnecting between the microwave chip and substract.In this paper,HFSS FEM software is performed the modeling,simulation,optimization of bump transitions and flip-chip structure,the equivalent lumped circuit model of bump transitions is extracted.We present the technology method and proecess of flip-chip and finish the test of experimentation sample.Finally,the applicatian prospects of microwave flip-chip bonding tech...