| 减薄划片过程中ESD的预防与控制 |
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| 引用本文： | 王义贤.减薄划片过程中ESD的预防与控制[J].电子工业专用设备,2008,37(8). |
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| 作者姓名： | 王义贤 |
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| 作者单位： | 浙江华越芯装电子股份有限公司,浙江,绍兴,312000 |
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| 摘 要： | SED在IC封装过程中对IC产品质量的影响越来越大。以生产过程中遇到的一些实际问题为例,分析探讨了ESD在封装生产过程对产品造成的影响,成因以及ESD的预防与控制方法。
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| 关 键 词： | 静电放电(ESD) 栅极氧化层 离子风 减薄 贴膜 揭膜 绷膜 划片 |
Prevention And Controlling Of ESD In Wafer Grinding And Dicing |
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| WANG Yi-xian.Prevention And Controlling Of ESD In Wafer Grinding And Dicing[J].Equipment for Electronic Products Marufacturing,2008,37(8). |
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| Authors: | WANG Yi-xian |
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| Abstract: | It is well known that ESD has deleterious effects on IC product quality during IC packaging. This thesis illuminates ESD's effects and causes clearly,what's more,it also advances some methods to prevent and control ESD,by analyzing the problems that often occurs in practical production. |
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| Keywords: | ESD Gate oxide layer Ion wind Wafer grind Wafer mount Dicing |
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