| Abstract: | Silicon nitride/glass fiber (Si3N4/GF) hybrid fillers are performed to prepare the Si3N4/GF/epoxy composites. Results showed the thermal conductivities of the Si3N4/GF/epoxy composites that are improved with the addition of Si3N4, and the thermal conductive coefficient λ is 1.412 W/mK with 38 vol% modified Si3N4/GF hybrid fillers (30 vol% Si3N4 + 8 vol% GF), seven times higher than that of pure epoxy resin. The flexural strength and impact strength of the composites are optimal with 13 vol% modified Si3N4/GF hybrid fillers (5 vol% Si3N4 + 8 vol% GF). The dielectric constant and dielectric loss of the composites are increased with the increasing addition of Si3N4. For a given Si3N4/GF hybrid fillers loading, the surface modification can further improve the thermal conductivities of the Si3N4/GF/epoxy composites. POLYM. COMPOS., 35:1338–1342, 2014. © 2013 Society of Plastics Engineers |
