Influence of metallic substrate surface engineering on peel resistance of adhesively bonded polymer film |
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| Authors: | Hadi Noori Mukesh Jain Kent Nielsen Frank Brandys |
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| Affiliation: | 1. Department of Mechanical Engineering, McMaster University, Hamilton, ON, Canadanoorih3@mcmaster.ca;3. Department of Mechanical Engineering, McMaster University, Hamilton, ON, Canada;4. 3M Canada Corporation, London, ON, Canada |
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| Abstract: | The peel resistance of adhesively bonded polymer films to a stainless steel sheet substrate (SSSS) with different engineered surface characteristics was examined in two different loading directions and for two different peel speeds. The SSSS was laminated with two thin polymeric adherends using two different pressure-sensitive adhesives. The SSSS surface was altered by grinding and knurling techniques before lamination and the effects of surface alterations on peel resistance were compared with peel resistance of the adherend from as-received SSSS with a bright annealed surface condition. For ground surface, an increase in adherend peel resistance was observed and the increase was attributed to increase in contact area between the adhesive and SSSS surface. For knurled surfaces which involved deeper and less frequent grooves, however, a decrease in peel resistance was observed. This was attributed to a more complex stress state at the peel front in the SSSS groove region during peeling. An increase in peel speed enhanced the peel resistance from both ground and knurled surfaces. |
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| Keywords: | adhesively bonded polymer film pressure-sensitive adhesive metallic substrate surface engineering peel test |
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