Properties of liquefied wood modified melamine-formaldehyde (MF) resin adhesive and its application for bonding particleboards |
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| Authors: | Nataša Čuk Matjaž Kunaver Ida Poljanšek Aleš Ugovšek Milan Šernek Sergej Medved |
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| Affiliation: | 1. Laboratory for Polymer Chemistry and Technology, National Institute of Chemistry, Hajdrihova 19, SI-1001, Ljubljana, Slovenianatasa.cuk@ki.si;3. Laboratory for Polymer Chemistry and Technology, National Institute of Chemistry, Hajdrihova 19, SI-1001, Ljubljana, Slovenia;4. Biotechnical Faculty, Department of Wood Science and Technology, University of Ljubljana, Ro?na dolina C VIII/34, SI-1000, Ljubljana, Slovenia;5. M SORA d.d., Trg svobode 2, SI-4226 ?iri, Slovenia |
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| Abstract: | In this study, we modified melamine-formaldehyde (MF) resin adhesive with liquefied wood (LW) and determined the properties of MF–LW adhesive mixtures. Furthermore, we produced particleboards using prepared MF–LW mixtures and evaluated their mechanical and physical properties. Results showed that with increasing content of LW in the adhesive mixture gel time and peak temperature increased while reaction enthalpy decreased. With increasing substitution of MF resin adhesive with LW the thermal stability of adhesive mixture reduced, namely thermal degradation started at lower temperature and weight loss increased. Properties of particleboards improved with increasing amount of LW in the adhesive mixture up to 20% and then deteriorated. Nevertheless, the properties of particleboard with 30% LW in the adhesive mixture were comparable to the properties of particleboard without LW while they worsen at greater portion of LW. Consequently, MF resin adhesive with 30% LW substitution could be used to produce particleboards with suitable mechanical properties and reduced formaldehyde release content. |
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| Keywords: | differential scanning calorimetry gel time liquefied wood mechanical properties melamine-formaldehyde resin adhesive particleboards pH thermogravimetric analysis |
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