Study on brown oxidation process with imidazole group,mercapto group and heterocyclic compounds in printed circuit board industry |
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| Authors: | Chong Wang Lin Xiang Yuanming Chen Shouxu Wang Dingjun Xiao Wei He |
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| Affiliation: | 1. State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu 610054, P.R. China;2. Research and Development Department, Guangdong Guanghua Sci-Tech Co., Ltd., Shantou 515000, P.R. Chinawangchong@uestc.edu.cn;4. Research and Development Department, Guangdong Guanghua Sci-Tech Co., Ltd., Shantou 515000, P.R. China;5. Research and Development Department, Guangdong Guanghua Sci-Tech Co., Ltd., Shantou 515000, P.R. China |
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| Abstract: | The adhesion strength of the interface between copper foil and resin is an important technological parameter for applications in microelectronics. In this study, a new brown oxidation solution of copper foil, including the recipe composition and reliability tests, was fully discussed. We provided an overview of brown oxidation process used in the semi-flexible printed circuit boards production industry by investigating the brown oxide film. The morphology of the copper oxide film was changed from lamellar structure to honeycomb structure with the increasing of oxidation time. The peel adhesion strength of the Cu/polyimide laminates was increased from about 2–16 N/cm by altering the immersion time and the concentration of inhibitors in brown oxidation solution. Scanning electron microscopy, peel tests and X-ray diffraction indicated that the higher adhesion strength was resulted from the rougher surface and the proper etching depth of copper foil, which was caused by chemical reactions on the interface surface of copper foil. |
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| Keywords: | brown oxidation PCB copper oxide film inhibitors peel adhesion strength |
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