Protection of copper surface in acidic chloride solution by non-toxic thiadiazole derivative

This paper deals with electrochemical properties of copper in the presence of the non-toxic compound 2-amino- 5-ethyl- 1,3,4-thiadiazole (AETDA) in acidic chloride solution. Electrochemical techniques: open circuit potential measurements, linear potentiodynamic measurements, cyclic voltammetry measurements and chronoamperometric measurements in addition to SEM–EDS analysis were used during the work. Results show that inhibition efficiency of 2-amino-5-ethyl-1,3,4-thiadiazole depends on inhibitor concentration and immersion time of copper electrode in inhibitor solution. Cyclic voltammetry and linear potentiodynamic measurements beside chronoamperometric measurements indicate formation of protective layer on copper surface. Moreover, results obtained by electrochemical measurements point out that the stability of formed layer depends primarily on the concentration of inhibitor and of potential values at which protective film is formed. Also, potentiodynamic measurements show that AETDA in acidic chloride solutions acts as mixed-type inhibitor. Inhibition mechanism of 2-amino-5-ethyl-1,3,4-thiadiazole includes adsorption of inhibitor on active sites on electrode surface which was confirmed by SEM–EDS analysis of the electrode surface. Adsorption of the AETDA in HCl solution obeys Langmuir adsorption isotherm.