| 铝合金周向包封陶瓷过程中温度场的数值模拟 |
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| 引用本文： | 赵凯雷,杨润泽,尹玉军,许保才.铝合金周向包封陶瓷过程中温度场的数值模拟[J].机械工程与自动化,2011(1):33-35,38. |
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| 作者姓名： | 赵凯雷 杨润泽 尹玉军 许保才 |
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| 作者单位： | 军械工程学院基础部,河北,石家庄,050003 |
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| 摘 要： | 利用AN SY S软件建立有限元模型,并合理地设置边界条件,对铝合金周向包封陶瓷过程的温度场进行数值模拟,得到了温度场的分布和变化规律。将模拟结果与实测结果相比较,表明模拟结果与实测结果吻合得较好,为下一步的应力场模拟提供了温度场条件。
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| 关 键 词： | ANSYS软件 铝合金 陶瓷 金属模具 温度场 |
Analysis of Temperature Distribution of Ceramics Wrapped by Aluminum Alloy Based on ANSYS Software |
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| ZHAO Kai-lei,YANG Run-ze,YIN Yu-jun,XU Bao-cai.Analysis of Temperature Distribution of Ceramics Wrapped by Aluminum Alloy Based on ANSYS Software[J].Mechanical Engineering & Automation,2011(1):33-35,38. |
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| Authors: | ZHAO Kai-lei YANG Run-ze YIN Yu-jun XU Bao-cai |
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| Affiliation: | ZHAO Kai-lei,YANG Run-ze,YIN Yu-jun,XU Bao-cai(Ordnance Engineering College,Shijiazhuang 050003,China) |
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| Abstract: | By establishing the finite element model and setting the reasonable boundary conditions,the temperature fields on aluminum alloy,ceramics and metal mold in the process of ceramics wrapped by aluminum alloy have been simulated by ANSYS software.The simulation result coincided well with the experimental result.The work has laid the basis for thermal stress analysis. |
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| Keywords: | ANSYS software aluminum alloy ceramics metal mold temperature field |
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