Manufacture and properties of cold spray deposited large thickness Cu coating material for sputtering target |
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Authors: | Jin-Hyeon Cho Young-Min Jin Dong-Yong Park Hyung-Jun Kim Ik-Hyun Oh and Kee-Ahn Lee |
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Affiliation: | (1) School of Advanced Materials Engineering, Andong National University, Andong, 760-749, Korea;(2) Tae-Kwang Tech, Gyungju, 780-874, Korea; |
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Abstract: | In this study, the manufacture of a large thickness Cu coating layer as sputtering target material via a cold spray coating
process was undertaken. The microstructure and properties of the Cu layer as the sputtering target material (before and after
the annealing heat treatment) were evaluated, compared, and analyzed. To evaluate the purity, density, grain size and uniformity,
microstructure, and properties of the Cu-coated layer as a sputtering target, X-ray diffraction, ICP analysis, SEM, EBSD,
porosity analysis, and Vickers hardness tests were performed. The result of the observation of the layer’s purity and microstructure
showed that a purity level (99.47%) similar to that of the early powder 2N5 was maintained and that the manufacture of a cold
spray deposited, ∼20 mm thick Cu coating material for the sputtering target was performed successfully. As a result of the
EBSD mapping, the average grain size near the interface and around the center measured 1.48 μm and 1.49 μm; the grains were
small and non-uniform compared with the 1.91 μm size near the surface. Note, however, that the recrystallization and grain
growth (caused by annealing) increased the grain size to 1.82 μm (near the interface), 1.83 μm (near the center), and 1.87
μm (near the surface) and improved the level of uniformity. Moreover, through post heat treatment, the overall porosity declined
(0.44 % porosity/400 °C/h heat treatment), and the grain texture became uniform. The possibility of controlling the microstructure
as a large thickness sputtering target by conducting an annealing heat treatment was also confirmed. Nonetheless, the differences
in the porosity and hardness associated with the coating thickness changes were partially maintained. Based on the aforementioned
findings, this study suggests that by using cold spray deposition, Cu coating layers with large thicknesses can be applied
as a sputtering target. |
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