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SiC陶瓷与316L不锈钢真空活性钎焊
引用本文:欧婷, 张德库, 王康, 王克鸿. SiC陶瓷与316L不锈钢真空活性钎焊[J]. 真空科学与技术学报, 2018, 38(10): 846-851. DOI: 10.13922/j.cnki.cjovst.2018.10.05
作者姓名:欧婷  张德库  王康  王克鸿
作者单位:1.南京理工大学 材料科学与工程学院 南京 210094
基金项目:国防科技创新特区资助项目 (17-H863-03-ZD-007-004-03)
摘    要:采用Ag-Cu-Ti活性钎料,通过真空钎焊方法进行了SiC陶瓷与316L不锈钢的连接,研究了接头的界面组织、特征点成分和物相,并探讨了钎焊温度(800~930℃)、保温时间(0~30 min)对接头界面组织和连接强度的影响。结果表明,SiC陶瓷与316L不锈钢钎焊抗剪断口均发生在SiC陶瓷与钎料连接界面处,由于活性元素Ti的作用,在陶瓷与钎料的界面处形成了连续的反应层,反应生成了Ti C和Ti5Si3;在316L不锈钢与钎料的界面处,生成了Fe-Ti化合物和Cu-Ti化合物。随着钎焊温度升高及保温时间延长,接头强度均呈现出一个峰值,在温度为900℃,保温20 min的工艺条件下可获得最大接头抗剪强度。

关 键 词:SiC陶瓷  316L不锈钢  真空钎焊  界面组织  接头强度
收稿时间:2018-03-28

Vacuum Brazing of SiC Ceramic and 316L Stainless Steel
Ou Ting, Zhang Deku, Wang Kang, Wang Kehong. Vacuum Brazing of SiC Ceramic and 316L Stainless Steel[J]. CHINESE JOURNAL VACUUM SCIENCE AND TECHNOLOGY, 2018, 38(10): 846-851. DOI: 10.13922/j.cnki.cjovst.2018.10.05
Authors:Ou Ting  Zhang Deku  Wang Kang  Wang Kehong
Affiliation:1.Nanjing University of Science and Technology, School of Materials Science and Engineering, Nanjing 210094, China
Abstract:The SiC rod (Ф15 mm×15 mm) and 316 L stainless steel disc (Ф15 mm×5 mm) were firmly jointed by vacuum brazing with AgCuTi alloy filler. The influence of the brazing temperature, holding time and interface properties on the phase-structures and bonding strength at the joints was investigated with X-ray diffraction, energy dispersive spectroscopy, scanning electron microscopy and mechanical tools. The results show that the brazing temperature, holding time and interface properties all had a major impact. For example, the shear fractures often occurred at the SiC/alloy-filler interface, where highly active Ti induced formation of a continuous reaction layer, mainly comprising Ti C and Ti5Si3 phases; in contrast, at the interface of stainless steel and alloy-filler, the intermetallics of Fe-Ti and Cu-Ti formed. Brazed at 900℃ for a holding time of 20 min, the joints displayed the strongest shear strength.
Keywords:SiC ceramic  316L stainless steel  Vacuum brazing  Interface structure  Bonding strength
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