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Selective carrier removal using oxygen implantation in GaAs
Authors:Berth   M. Venger   C. Martin   G.M.
Affiliation:Laboratoires d'Electronique et de Physique Appliquée, Limeil-Brévannes, France;
Abstract:It has been reported that free-carrier compensation can be achieved using oxygen implantation and can remain stable even after annealing at temperatures up to 900°C. It is demonstrated that carrier removal rate is drastically dependent on the initial donor species. It is very likely that carrier removal in Si-doped layers takes place via formation of Si-O complexes.
Keywords:
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