| 磁控溅射钛膜的沉积过程及表面形貌研究 |
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| 引用本文： | 李丽,吴卫,金永中,于越. 磁控溅射钛膜的沉积过程及表面形貌研究[J]. 西华大学学报(自然科学版), 2009, 28(2) |
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| 作者姓名： | 李丽 吴卫 金永中 于越 |
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| 作者单位： | 1. 西华大学材料科学与工程学院,四川,成都,610039
2. 四川理工学院,四川,自贡,643000 |
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| 基金项目： | 国家高技术研究发展计划(863计划) |
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| 摘 要： | 实验研究了在磁控溅射工艺的溅射功率和工作压强恒定的情况下,薄膜在基底表面的沉积及生长的过程.结果表明,在溅射参数恒定、Ti膜尚未连续的情况下,薄膜的覆盖率的对数与时间基本成正比关系,即薄膜的覆盖率随时间指数增加.在薄膜连续后,出现晶粒长大并合并的现象.薄膜的生长方式为先层状生长再岛状生长.
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| 关 键 词： | 真空技术 Ti膜 磁控溅射 表面形貌 |
Research on Forming Process and Surface Topography of Ti Thin Film Deposited by Magnetron Sputtering |
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| LI Li,WU Wei,JIN Yong-zhong,YU Yue. Research on Forming Process and Surface Topography of Ti Thin Film Deposited by Magnetron Sputtering[J]. Journal of Xihua University(Natural Science Edition), 2009, 28(2) |
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| Authors: | LI Li WU Wei JIN Yong-zhong YU Yue |
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| Affiliation: | 1.School of Material Science and Engineering;Xihua University;Chengdu 610039;2.Sichuan University of Science & Engineering;Zigong 643000 China |
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| Abstract: | The research on forming process and surface topography of Ti thin film deposited by magnetron sputtering is conducted.The results obtained show that,when the parameters of working power and pressure of argon keep constant during magnetron sputtering,the logarithm of the percentage of film coverage on the base material is direct proportional to the time at initiation of sputtering,that is,the percentage of film coverage on the base material increases according to exponential rule with time.The percentage of ... |
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| Keywords: | vacuum Ti thin film magnetron sputtering surface topography |
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