Coupled electro-thermal modeling and optimization of clock networks

In this paper a coupled electro-thermal model is used for the optimal design of the clock distribution tree of a high performance microprocessor. Such approach allows simultaneously to take into account both thermal and electrical constraints. In particular timing issues such as clock delay from the root of the tree to the leaves and skew between the leaves are optimized by a suitable wire and buffer sizing. At the same time the lifetime constraints of clock wires that are affected by the electromigration, enhanced by the high temperature reached in interconnects due to the Joule self-heating, are checked and respected.