| 关于印制板插头电镀硬质金工艺方案的选择 |
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| 引用本文： | 顾福林.关于印制板插头电镀硬质金工艺方案的选择[J].电镀与涂饰,2007,26(3):42-44. |
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| 作者姓名： | 顾福林 |
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| 作者单位： | 无锡表面工程协会,江苏,无锡,214001 |
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| 摘 要： | 氰化电镀工艺有害环境及健康,逐渐淘汰。本文阐述了当今国内外镀金方法,分析了氰化、无氰镀金工艺的优缺点,为厂印制板插头电镀硬质金工艺方案作出合理选择,并在生产中得到成功应用。
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| 关 键 词： | 印制板插头 无氰镀金 镀硬金 |
| 文章编号： | 1004-227X（2007）03-0042-03 |
| 修稿时间： | 2006-09-252006-11-24 |
Selection of process schemes of hard gold plating for plugs of printing board |
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| GU Fu-lin.Selection of process schemes of hard gold plating for plugs of printing board[J].Electroplating & Finishing,2007,26(3):42-44. |
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| Authors: | GU Fu-lin |
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| Affiliation: | Wuxi Surface Engineering Association, Wuxi 214001, China |
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| Abstract: | The cyanide plating technology has been gradually phased out for its endangering environment and health. Some kinds of method of plating gold at home and abroad were reviewed. The advantages and disadvantages of cyanide and non-cyanide plating were analyzed. A rational selection of hard gold plating technology was made, which has been successfully applied in production. |
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| Keywords: | plugs of printing board non-cyanide plating hard gold plating |
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