| 焊膏印刷领域中的热门先进技术 |
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| 引用本文： | 鲜飞.焊膏印刷领域中的热门先进技术[J].电子工业专用设备,2007,36(7):51-53. |
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| 作者姓名： | 鲜飞 |
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| 作者单位： | 烽火通信科技股份有限公司,湖北武汉,430074 |
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| 摘 要： | 焊膏印刷是SMT生产中关键工序之一,其控制直接影响着组装板的质量。简要介绍了当前焊膏印刷领域中的一些热门先进技术。焊膏喷印是现代组装技术的新概念,它的出现促进了SMT的发展。可以确信焊膏喷印将会被更多地应用于电子组装上,成为一种具有竞争力的焊膏印刷技术。
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| 关 键 词： | 表面贴装技术 焊膏印刷 线路板 焊膏喷印 |
| 文章编号： | 1004-4507（2007）07-0051-03 |
| 修稿时间： | 2007-05-31 |
Popular and Advanced Technique in The Field of Solder-paste Printing |
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| XIAN Fei.Popular and Advanced Technique in The Field of Solder-paste Printing[J].Equipment for Electronic Products Marufacturing,2007,36(7):51-53. |
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| Authors: | XIAN Fei |
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| Affiliation: | Fiberhome Telecommunication Technologies Co., Ltd, Wuhan 430074,China |
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| Abstract: | Solder-paste printing plays an important part in SMT production, and affects the quality of assemblies, the article simply introduces popular and advanced technique in the field of solder paste printing. JetPrinting Technology is a new concept of the contemporary assembly technology. It is said that JetPrinting Technology has developed and innovated SMT since it was appeared. It is believed that JetPrinting will more be adopted in electronics assembly, and will also be a competitive solder-paste printing technology. |
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| Keywords: | SMT Solder-paste printing PCB JetPrinting Technology |
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