大规模集成电路封装用联苯型环氧树脂的制备及其结构与性能

采用３，3′，5，5′-四甲基-4，4′-联苯二酚与环氧氯丙烷在18-冠-6-醚(CE18)为相转移催化剂作用下，利用两步加碱法合成了联苯型环氧树脂（TMBP），在反应温度为80 ℃、反应时间为8 h、NaOH用量为0.2 mol时，产率达83 ％。用核磁共振、红外光谱、X射线衍射、热台偏光显微镜和DSC对所制备的产物进行了结构表征。结果表明，合成的产物为TMBP，具有良好的结晶性，熔点为107.8 ℃，在冷却过程中出现液晶态。TMBP熔融黏度极低（0.02 Paos,150 ℃），用TMBP与酚醛环氧树脂（ECN）共混，可降低体系的黏度，从而提高硅微粉的填充量和大规模集成电路封装材料的流动性。

Synthesis,Structure and Properties of Biphenyl Epoxy Resin for Integrated Circuit Encapsulation

Tetramethyl biphenyl epoxy resin (TMBP) was synthesized from 3,3',5,5'-tetramethyl-biphenyl-4,4'-diol and epichlorohydrin via a two-step method using 18-crown-6-ether as a Phase-transfer catalyst. The effect of temperature, reaction time, and phase-transfer catalyst on product yield was investigated. It was found that a maximum product yield of 83 % was obtained at 80 ℃ for 8 h. The chemical structure of TMBP was characterized with 1H-NMR、FTIR、XRD、POM and DSC. DSC showed that the melting temperature of TMBP was 107.8 ℃. POM results indicated that TMBP was a crystalline oligomer and its liquid crystalline behavior appears when cooled down from 120 to 76.2 ℃. TMBP has very low ηa (0.02 Paos at 150 ℃) and can be blended with ortho-cresol novolac epoxy resin(ECN) in order to decrease ηa of epoxy molding composite(EMC). It was concluded that TMBP can be used as a matrix resin for manufacturing epoxy molding compounds for integrated circuit encapsulation.