| 再流焊工艺技术研究 |
| |
| 引用本文： | 鲜飞. 再流焊工艺技术研究[J]. 电子与封装, 2005, 5(3): 16-18,5 |
| |
| 作者姓名： | 鲜飞 |
| |
| 作者单位： | 烽火通信科技有限公司,湖北,武汉,430074 |
| |
| 摘 要： | 随着表面贴装技术的发展,再流焊越来越受到人们的重视。本文介绍了再流焊接的一般技术要求,并给出了典型温度曲线以及温度曲线上主要控制点的工艺参数。同时还介绍了再流焊中常见的质量缺陷,并粗浅地讨论了其产生的原因及其相应对策。
|
| 关 键 词： | 再流焊 表面贴装技术 表面组装组件 温度曲线 |
| 文章编号： | 1681-1070(2005)03-16-03 |
The Research of Reflow Soldering |
| |
| Xian Fei. The Research of Reflow Soldering[J]. Electronics & Packaging, 2005, 5(3): 16-18,5 |
| |
| Authors: | Xian Fei |
| |
| Abstract: | With the development of Surface Mount Technology, reflow soldering becomes more and more important.The article introduces the general technology requirements for reflow soldering and typical temperature profile and technical parameter of the main control point at the temperature profile, and also describes common quality defects of reflow soldering, briefly discusses the reasons of producting defects and appropriate countermeasure. |
| |
| Keywords: | Reflow soldering SMT SMA Temperature profile |
| 本文献已被 CNKI 维普 万方数据 等数据库收录！ |
|
