| 封装外壳散热技术及其应用 |
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| 引用本文： | 龙乐.封装外壳散热技术及其应用[J].电子与封装,2008,8(3):6-11. |
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| 作者姓名： | 龙乐 |
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| 作者单位： | 成都龙泉天生路205号1栋208室,成都,610100 |
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| 摘 要： | 微电子器件的封装密度不断增长，导致其功率密度也相应提高，单位体积发热量也有所增加。为此，文章综述了封装外壳散热技术的基本原理、最新发展及其应用，并简要讨论了封装外壳散热技术的未来发展趋势及面临的挑战
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| 关 键 词： | 芯片冷却 散热器 热管理 |
| 文章编号： | 1681-1070(2008)03-0006-05 |
| 修稿时间： | 2007年11月6日 |
Heat Disspation Technology and Its Applications in Electronic Packaging |
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| LONG Le.Heat Disspation Technology and Its Applications in Electronic Packaging[J].Electronics & Packaging,2008,8(3):6-11. |
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| Authors: | LONG Le |
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| Affiliation: | LONG Le ( Tiansheng Road 205,1-208, Longquan, Chengdu 610100, China ) |
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| Abstract: | As microelectronic device packaging density becomes more complex and compact, its power density and amount of heat disspation increases correspondinngly. Therefore, this paper presents an over-view of the principle for heat disspation technology, the new development and application of heat disspation are also discussed. A brief disussion of the future trends and challenges of package heat disspation technol-ogy are also described. |
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| Keywords: | chip cooling heat sink thermal management |
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