溶胶凝胶法在铝基片上沉积Si0x薄膜及结合性能

为了获得性能良好的蛋白质芯片的固相载体,采用溶胶-凝胶工艺并结合旋转涂布技术在Al基片上沉积硅氧化物薄膜,考察了薄膜的表面形貌、组成、结构以及与基片的结合性能.结果表明:酸性溶胶在Al基片上沉积薄膜容易产生较多较大的裂纹,严重影响薄膜的表面性能;以浓氨水为催化剂获得的碱性溶胶在Al基片上涂膜,干燥过程中产生的内应力较小,获得的SiOx薄膜表面较均匀,虽然仍存在少量裂纹,但较细小.添加少量DMF于碱性溶胶中可获得比表面积大、无裂缝、与基片结合强度较高的均匀非晶态硅氧化物薄膜,有望作为蛋白质芯片的固相载体.

Preparation of SiOx Film by Sol-gel Process and Its Adhesion to Al Substrate

In order to fabricate high quality solid carrier for protein chip, silicon oxides ( SiOx) thin film was prepared on Al substrate by sol-gel and spin coating technique, and its surface morphology, structure, composition and adhesion to Al substrate were examined by SEM, TEM, XRD and EDX. The results show that the SiOx thin film prepared by acid sol will seriously crack, which obviously deteriorates its surface performance. However, at same experiment condition , the SiOx thin film fabricates with alkalescent sol possesses more uniform surface with a few fine cracks for forming less stress in heating treatment. Furthermore , a non-crystalline SiOx film with larger special area, uniform roughness, free of any cracks and firm adhesion to Al substrate is prepared by alkalescent sol added a small quantity of DMF, which is expected to use as solid carrier for protein chip.