Transient liquid phase bonding of 2124 aluminium metal matrix composite

Abstract

The transient liquid phase (TLP) bonding of particle reinforced aluminium metal matrix composites (MMCs) using copper interlayers often results in the segregation of SiC particles to the bond region, and this has the effect of producing bonds with poor mechanical strengths. In this preliminary study, the TLP bonding of a 2124 aluminium alloy MMC is investigated using nickel interlayers, and the initial results show that good bonds are produced with no effect on the SiC dispersion in the matrix. The absence of segregation is attributed to the high diffusivity of the nickel in the aluminium MMC, which produces rapid isothermal solidification at the bonding temperature. Bond shear tests show that near parent metal strengths are possible when thin nickel interlayers are used, and failure occurs at the MMC/bond interface. When thick interlayers are used, failure is predominately through the centre of the bondline.