| 铜锡钛合金炉中钎焊立方氮化硼界面微观结构 |
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| 引用本文： | 张志伟,徐九华,丁文锋,傅玉灿.铜锡钛合金炉中钎焊立方氮化硼界面微观结构[J].焊接学报,2011,32(1):73-76. |
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| 作者姓名： | 张志伟 徐九华 丁文锋 傅玉灿 |
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| 作者单位： | 南京航空航天大学机电学院,南京,210016 |
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| 基金项目： | 国家重点基础研究发展计划资助项目，教育部新世纪优秀人才资助计划，"高档数控机床与基础制造装备" 国家科技重大专项课题 |
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| 摘 要： | 采用真空炉中钎焊的方法,应用Cu-Sn-Ti合金实现了立方氮化硼(CBN)磨粒与工具基体的钎焊连接.运用三维视频显微镜、扫描电镜(SEM)、能谱仪(EDS)及X射线衍射仪对微观形貌、元素分布和生成物物相进行了观测分析,发现活性Ti元素明显向CBN磨粒表面发生偏聚,在CBN磨粒表面生成TiN,TiB和TiB2,这些反应产...
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| 关 键 词： | 真空钎焊 铜锡钛合金 立方氮化硼 微观结构 |
| 收稿时间： | 2009/9/11 0:00:00 |
Interfacial microstructure of cubic boron nitride grains brazed with Cu-Sn-Ti filler alloy in vacuum furnace |
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| ZHANG Zhiwei,XU Jiuhu,DING Wenfeng and Fu Yucan.Interfacial microstructure of cubic boron nitride grains brazed with Cu-Sn-Ti filler alloy in vacuum furnace[J].Transactions of The China Welding Institution,2011,32(1):73-76. |
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| Authors: | ZHANG Zhiwei XU Jiuhu DING Wenfeng and Fu Yucan |
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| Affiliation: | College of Mechanical and Electrical Engineering, Nanjing University of Aeronautics and Astronautics, Nanjing 210016, China,College of Mechanical and Electrical Engineering, Nanjing University of Aeronautics and Astronautics, Nanjing 210016, China,College of Mechanical and Electrical Engineering, Nanjing University of Aeronautics and Astronautics, Nanjing 210016, China and College of Mechanical and Electrical Engineering, Nanjing University of Aeronautics and Astronautics, Nanjing 210016, China |
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| Abstract: | The Cu-Sn-Ti active filler alloy was utilized to braze CBN(cubic boron nitride) to steel substrate in vacuum furnace.The microstructure and the element distribution,as well as the topography and phases of the compounds were analyzed by optical microscopy,scanning electron microscope(SEM),energy dispersion spectrometer(EDS) and X-ray diffraction(XRD).The results show that the active element Ti migrated from the filler layer to the surface of the CBN grains to form the compounds such as TiN,TiB and TiB2,which play an important role in the joining of CBN grain and Cu-Sn-Ti alloy.As a result,the layer of TiN+TiB+TiB2-Cu/Sn/Ti intermetallic compound-Cu/Fe/Sn diffusion layer and Fe/Ti compound were formed between the interface of CBN and metal matrix. |
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| Keywords: | vacuum brazing Cu-Sn-Ti filler alloy cubic boron nitride microstructure |
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