| 2009LED环氧树脂基础固化配方的研究 |
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| 引用本文： | 崔佳,曲敏杰,李晶,刘海波,胡那,张艳玲.2009LED环氧树脂基础固化配方的研究[J].大连工业大学学报,2009,28(2). |
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| 作者姓名： | 崔佳 曲敏杰 李晶 刘海波 胡那 张艳玲 |
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| 作者单位： | 大连工业大学化工与材料学院,辽宁大连,116034 |
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| 摘 要： | 以环氧树脂为基体树脂,向其加入固化剂、抗氧化剂、固化促进剂,并在适当的温度下固化。以灌封料的弯曲强度为指标,通过正交试验确定了环氧树脂固化工艺的最佳条件是:环氧树脂为100 g,固化促进剂用量为0.7 g,抗氧化剂为0.3 g,固化温度为140℃,固化剂为96.3 g。在此条件下,环氧树脂灌封料的弯曲强度可以达到28.3 MPa。
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| 关 键 词： | 环氧树脂 灌封料 配方 固化 |
Modification of epoxy resin by solidification LED |
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| CUI jia,QU Min-jie,LI jing,LIU Hai-bo,HU Na,ZHANG Yan-ling.Modification of epoxy resin by solidification LED[J].Journal of Dalian Dalian Polytechnic University,2009,28(2). |
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| Authors: | CUI jia QU Min-jie LI jing LIU Hai-bo HU Na ZHANG Yan-ling |
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| Abstract: | The solidification of epoxy resin by adding curing reagent,solidify accelerant and antioxidant was studied at different temperature and the band intension of enveloping resin was determined.The optimum process condition was epoxy resin 100 g,solidify accelerant 0.7 g,antioxidant 0.3 g,solidify temperature 140 ℃ and curing reagent 96.3 g.in which the band intension of enveloping epoxy resin was 28.3 MPa. |
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