电子芯片冷却用微管道散热器的换热性能分析

在对电子芯片内部冷却用的微管道散热器进行传热性能分析时,现有分析方法大都仅能在假设微管道下壁上的热载荷处于均匀分布时适用.当微管道下壁上的热载荷处于任意分布情况时,利用文中设计的有限元分析法可对微管道散热器的传热性能进行分析.在微管道下壁上的热载荷处于不同的分布情况下,利用伽辽金有限元公式计算了微管道散热器中的微管道表面温度分布、流体温度分布及散热器总热阻等;通过与现有的分析方法所得结果进行对比:在对热载荷均匀分布状态下的微管道散热器进行传热性能分析时,有限元方法完全可作为CFD(Calculated Fluid Dynamics)法的一种替代,且使用有限元方法对微管道散热器进行传热分析时的运算更为快捷.当微管道下壁上的热载荷处于任意非均匀分布状态时,利用文中设计的有限元分析法仍可有效地对微管道散热器的传热性能进行分析;因此有限元分析法也可用于研究微管道散热器的几何参数对散热器传热性能的影响.

Analysis of Heat Transfer Performance about Microchannel Heat Sinks for Electronic Equipment Cooling

In the Study of performance of heat transfer in microchannel heat sinks used for cooling electronic chips, the available methods mostly assume microchannel sinks with uniform heat flux distribution.Finite element method, which can analyze microchannel heat sinks with non uniform heat flux distribution,is presented.Compared with the results derived from existing methods for instance massive Calculated Fluid Dynamics calculations,in spite of arbitrary heat flux distribution occurred,heat transfer performance about microchannel heat sinks can be analyzed efficiently and more rapidly by the finite element method presented in this paper.A Galerkin finite element formulation has been used to predict the surface temperature,the fluid temperature and the total thermal resistance of the microchannel heat sinks with different heat flux distribution, finite element method is used to study the effect of geometrical parameters on the performance of the microchannel heat sinks at last.