| Sb掺杂对SnAgCu无铅焊点电迁移可靠性的影响 |
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| 引用本文： | 何洪文,徐广臣,郭福. Sb掺杂对SnAgCu无铅焊点电迁移可靠性的影响[J]. 电子元件与材料, 2008, 27(8) |
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| 作者姓名： | 何洪文 徐广臣 郭福 |
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| 作者单位： | 北京工业大学,材料科学与工程学院,北京,100022 |
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| 摘 要： | 向Sn3.8Ag0.7Cu无铅焊膏中添加质量分数为1%的Sb金属粉末,研究了其焊点在电流密度为0.34×104A/cm2、环境温度150℃下的电迁移行为。通电245h后,阴极处钎料基体与Cu6Sn5IMC之间出现一条平均宽度为16.9μm的裂纹,阳极界面出现凸起带,钎料基体内部也产生了裂纹。结果表明:1%Sb的添加使焊点形成了SnSb脆性相,在高电流密度和高温环境下产生裂纹,缩短了焊点寿命,降低了电迁移可靠性。
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| 关 键 词： | 电子技术 无铅焊点 电迁移 可靠性 |
Effect of Sb doped SnAgCu lead-free solder joint on electromigration reliability |
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| HE Hong-wen,XU Guang-chen,GUO Fu. Effect of Sb doped SnAgCu lead-free solder joint on electromigration reliability[J]. Electronic Components & Materials, 2008, 27(8) |
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| Authors: | HE Hong-wen XU Guang-chen GUO Fu |
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| Affiliation: | HE Hong-wen,XU Guang-chen,GUO Fu (School of Materials Science & Engineering,Beijing University of Technology,Beijing 100022,China) |
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| Abstract: | Mass fraction of 1% Sb metal powder was added into Sn3.8Ag0.7Cu lead-free solder paste. And electromigration behavior of its solder joint was investigated under 0.34×104 A/cm2 and 150 ℃. After energization for 245 h, a long crack of average width of 16.9 μm appeared along the interface between solder matrix in the cathode side, and Cu6Sn5 IMC, a narrow hillock line formed on the interface of the anode side, many cracks appeared in the solder matrix inside. Results indicate that SnSb brittle phase in solder joint is formed when 1% Sb is added into the paste, therefore cracks are easily formed under high current density and high ambient temperature, which shorts the liftime and degrades the electromigration reliability of the solder joint. |
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| Keywords: | electron technology lead-free solder joint electromigration reliability |
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