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氧等离子体处理条件对聚硅烷制备SiO2/Si结构平带电压的影响
引用本文:向少华,谢茂浓,张明高,廖伟,彭志坚,傅鹤鉴.氧等离子体处理条件对聚硅烷制备SiO2/Si结构平带电压的影响[J].半导体技术,2001,26(1):57-59.
作者姓名:向少华  谢茂浓  张明高  廖伟  彭志坚  傅鹤鉴
作者单位:1. 怀化师专物理系,
2. 四川大学物理系,
3. 四川大学化学系,
基金项目:国家自然科学基金;29771024;
摘    要:氧等离子体处理高阻P型(100)硅片上的聚硅烷涂层制备SiO2/Si结论。其MOS结构平带电压随氧等离子体处理时间、反应室气压、射频功率等条件的改变而变化,平带电压最小可达-0.55~-0.88V比同一环境热氧化制备的SiO2/Si结构平带电压小得多。

关 键 词:氧等离子体  聚硅烷涂层  平带电压  二氧化硅/硅结构
文章编号:1003-353X(2001)01-0057-03
修稿时间:1999年12月27日

Influence of treatments on the flat-band voltage of SiO2/Si
XIANG Shao-hua,XIE Mao-nong,ZHANG Ming-gao,LIAO Wei,PENG Zhi-jian,FU He-jian.Influence of treatments on the flat-band voltage of SiO2/Si[J].Semiconductor Technology,2001,26(1):57-59.
Authors:XIANG Shao-hua  XIE Mao-nong  ZHANG Ming-gao  LIAO Wei  PENG Zhi-jian  FU He-jian
Abstract:The SiO2/Si structure was formed when ploysilane coating on Si substrate was treated by O2-plasma method. The flat-band voltage was measured by the conventional MOS capacitance method. The results showed that the flat-band voltage was dependent on the conditions of O2-plasma such as reactant pressure, treatment time and radio-frequency power. When an optimal treatment condition was selected, it was up to a minimal value in the range of --0.55~-0.88V, which was less than that of SiO2/Si structure by thermal oxidation under the same experimental environment.
Keywords:O2-plasma  polysilane coating  flat-band volt
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