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热管模组在机载ATR密闭机箱中的应用研究
引用本文:徐立颖.热管模组在机载ATR密闭机箱中的应用研究[J].电子机械工程,2021,37(6):22-28.
作者姓名:徐立颖
作者单位:中国电子科技集团公司第十五研究所,北京100083
摘    要:某机载电子设备(ATR)密闭机箱内集成了多个中央处理器(Central Processing Unit, CPU)热源,单个CPU热源的热功耗达到了80 W。为了解決整机在高温环境下的散热问题,文中给出了一种基于热管模组的机箱散热结构。通过对热管模组的结构设计,在实现机箱密闭结构的基础上,将每个热源的热量快速传导至机箱两侧的风道内,提高了热源与外界热沉之间的导热效率。对热管模组中的热传导结构、肋片散热器的参数设置以及风机选型进行了理论分析计算,得出了热管模组具有导热效率高、热阻低的性能特点。借助ANSYS Icepak热仿真软件,对热管模组的散热性能进行了模拟仿真,并对仿真结果与设备在高温试验环境下CPU的温度测试结果进行了对比。对比结果表明,热仿真在设计阶段能够比较真实地反映热设计效果,热管模组的散热性能满足机箱的散热需求,解决了机箱内部多热源的散热问题。文中解决ATR密闭机箱多热源散热设计的有效方法对类似机箱的热设计具有参考价值。

关 键 词:ATR  密闭机箱  CPU  热管模组  导热  肋片散热器  热设计  热仿真

Application Research on Heat Pipe Module in Airborne ATR Closed Cabinet
XU Liying.Application Research on Heat Pipe Module in Airborne ATR Closed Cabinet[J].Electro-Mechanical Engineering,2021,37(6):22-28.
Authors:XU Liying
Affiliation:The 15th Research Institute of CETC
Abstract:In the ATR closed cabinet, multiple central processing units (CPU) heat sources are integrated. The thermal power consumption of a single CPU heat source reaches 80 W. In order to solve the heat dissipation problem of the whole device in high temperature environment, a heat dissipation structure of the cabinet based on heat pipe module is proposed. Through structural design of the heat pipe module, on the basis of making the cabinet closed, the heat of each heat source is quickly transmitted to the air ducts on both sides of the cabinet, thus the heat conduction efficiency between the heat source and the external heat sink is improved. The heat conduction structure of the heat pipe module, the parameter setting of the fin radiator of the heat pipe module and the type selection of the fan are theoretically analyzed and calculated. It is concluded that the heat pipe module has the characteristics of high heat conduction efficiency and low thermal resistance. The heat dissipation performance of the heat pipe module is simulated by ANSYS Icepak thermal simulation software. The simulation result is compared with the temperature test results of CPU in the high temperature test environment. The comparison results show that the thermal simulation can truly reflect the thermal design effect in the design stage, and the heat dissipation performance of the heat pipe module meets the heat dissipation requirements of the cabinet and the heat dissipation problem of multi-heat source inside the cabinet is solved. The effective method of solving the heat dissipation problem of multi-heat source in ATR closed cabinet can be used as a reference for the thermal design of similar cabinets.
Keywords:ATR  closed cabinet  CPU  heat pipe module  heat conduction  fin radiator  thermal design  thermal simulation
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