Interdiffusion in copper-rich cu-ag solid solutions

Interdiffusion was studied in the temperature between 974 and 1273 K, using conventional sandwich-type diffusion couples consisting of pure copper and Cu-2.1 at. pct Ag alloy. The interdiffusion coefficient, , increased slightly with increasing the atomic fraction of silver, N_Ag. Values of were well represented by the parameters of ₀ = 0.21 x 10^-4 (m²/s) and ≈ = 184.5 - 143.0 N_Ag (kJ/g-atom) up toNAg = 0.02. The Kirkendall effect during diffu-sion treatments at 1174 K for up to 1.4724 x 10⁶ s was also studied. The marker moved always toward the silver-rich side. The ratio, D*_Ag / D*_Cu,was 5.6 for N_Ag = 0.011, while it was 4.2 for N_Ag = 0.