| 多层陶瓷电容器端电极可靠性的显微研究 |
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| 引用本文： | 史光华,包生祥,庄立波,汪蓉.多层陶瓷电容器端电极可靠性的显微研究[J].压电与声光,2011,33(3). |
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| 作者姓名： | 史光华 包生祥 庄立波 汪蓉 |
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| 作者单位： | 1. 电子科技大学电子薄膜与集成器件国家重点实验室,四川成都,610054
2. 成都宏明电子科大新材料有限公司,四川成都,610058 |
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| 摘 要： | 多层陶瓷电容器(MLCC)端电极在实际使用过程中,其电性能会随着时间发生不同程度的偏离,可焊性、耐焊接热等可靠性降低.针对多层陶瓷电容器端电极锡镀层在焊接过程中发生焊接失效问题,利用扫描电子显微镜(SEM)分析了正常样品和可焊性变差样品锡镀层的微观结构,并运用X线能谱(EDS)仪对问题样品进行成分分析.其结果表明,可焊性变差样晶端电极表面锡镀层出现了因氧化产生的异常区域,并通过后期的可焊性实验验证了分析结果,找出了端电极焊接失效的原因,并提出应对端电极氧化问题的改进措施.
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| 关 键 词： | 多层陶瓷电容器(MLCC) 失效分析 氧化 端电极 |
Research on Microstructure Reliability of the Termination Electrode of MLCC |
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| SHI Guanghua,BAO Shengxiang,ZHUANG Libo,WANG Rong.Research on Microstructure Reliability of the Termination Electrode of MLCC[J].Piezoelectrics & Acoustooptics,2011,33(3). |
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| Authors: | SHI Guanghua BAO Shengxiang ZHUANG Libo WANG Rong |
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| Affiliation: | SHI Guanghua1,BAO Shengxiang1,ZHUANG Libo1,WANG Rong2 (1.State Key Lab.of Electronic Thin Films and Integrated Devices,University of Electronic Science and Technology,Chengdu 610054,China,2.Chengdu Hongming UESTC New Material Co.Ltd.,Chengdu 610058,China) |
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| Abstract: | In practical application,the electronic parameter of multilayer ceramic capacitor(MLCC) will change and the reliability will degrade until MLCC is judged to be failure.Aimed at the problem of tin-coating in MLCC devices,the microstructure and components of tin-coating are studied with SEM and EDS,and the welding failure modes occurred in the outer-electrode are documented.The results show that there have been some abnormal areas on the tin-coating of samples with weldable problem produced by oxidation.Later... |
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| Keywords: | MLCC failure analysis oxidation termination electrode |
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