Study of wetting reaction between eutectic AuSn and Au foil |
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Authors: | Y T Lai C Y Liu |
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Affiliation: | (1) Department of Chemical Engineering and Materials Engineering, National Central University, Jhong-Li, Taiwan |
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Abstract: | Wetting reactions between eutectic AuSn solder and Au foil have been studied. During the reflow process, Au foil dissolution
occurred at the interface of AuSn/Au, which increases with temperature and time. The activation energy for Au dissolution
in molten AuSn solder is determined to be 41.7 kJ/mol. Au5Sn is the dominant interfacial compound phase formed at the interface. The activation energy for the growth of the interfacial
Au5Sn phase layer is 54.3 kJ/mol over the temperature range 360–440°C. The best wettability of molten AuSn solder balls on Au
foils occurred at 390°C (wetting angle is about 25°). Above 390°C, the higher solder oxidation rate retarded the wetting of
the molten AuSn solder. |
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Keywords: | Soldering packaging |
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