玻璃基片上双层多模光波导的制备

在光学玻璃基片上制作了双层掩埋式多模光波导芯片,这种芯片中的上、下两层光波导均通过熔盐离子交换和电场辅助离子迁移形成。对光波导的横截面以及输出光斑进行了观察,并进行了损耗和串扰测试。研究结果表明:双层多模光波导芯片中上、下两层光波导芯部横截面尺寸分别为29 m19 m和31 m20 m;两层波导的输出光斑尺寸相互匹配;两层波导传输损耗分别为1.000.32 dB/cm和0.780.35 dB/cm;两层光波导之间的串扰在17.7dB左右。这种玻璃基片上的双层多模光波导可以使板级光互连的互连密度增大一倍,提高EOCB的性能。

Manufacturing of double-layered multimode optical waveguides in glass substrate

Double-layered multimode waveguides were fabricated in optical glass substrate, each layer being formed by melt salt ion-exchange(IE), and subsequent field-assisted ion-migration(FAIM). Characterization of the double-layered waveguide chips were performed by microscopic observation of waveguide cross-section, output pattern observation, and insertion loss and crosstalk measurement. Results shows that dimensions of waveguides core at top layer and bottom layer core are respectively 29 m19 m and 31 m20 m, and output pattern of waveguide at different layers are of nearly the same dimensions. Waveguide loss characterization show that propagation loss of waveguide at top layer and bottom layer are 1.000.32 dB/cm and 0.780.35 dB/cm, and crosstalk between neighbor waveguide at different layers is approximately 17.7 dB. Analysis demonstrate that interconnection density can be doubled by adopting double-layered waveguide, thus this kind of waveguide can be expected a promising prospect in improving EOCB performance.