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Elastomeric Thermal Interface Materials with High Through‐Plane Thermal Conductivity from Carbon Fiber Fillers Vertically Aligned by Electrostatic Flocking
Authors:Kojiro Uetani  Seisuke Ata  Shigeki Tomonoh  Takeo Yamada  Motoo Yumura  Kenji Hata
Affiliation:1. Technology Research Association for Single Wall Carbon Nanotubes (TASC), Tsukuba, Ibaraki, Japan;2. Nanotube Research Center, National Institute of Advanced Industrial Science and Technology (AIST), Tsukuba, Ibaraki, Japan
Abstract:
Keywords:thermal interface materials  vertically aligned carbon fibers  electrostatic flocking  through‐plane thermal conductivity
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