| 焊膏印刷工艺技术的研究 |
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| 引用本文： | 鲜飞. 焊膏印刷工艺技术的研究[J]. 印制电路信息, 2007, 0(8): 55-63 |
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| 作者姓名： | 鲜飞 |
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| 作者单位： | 烽火通信科技股份有限公司,湖北,武汉,430074 |
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| 摘 要： | 焊膏印刷是SMT生产中关键工序之一,其控制直接影响着组装板的质量。本文介绍了焊膏印刷中影响质量的诸多因素并分析其原因,并提出部分纠正措施和建议。同时文中扼要的介绍焊膏高度检测的原理及应用,指出了3D AOI是保证电子组装质量的必要手段。最后,本文还介绍了一些焊膏印刷的新技术。
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| 关 键 词： | 焊膏 网板 印刷 表面贴装技术 缺陷 检测 |
| 文章编号： | 1009-0096(2007)08-0055-09 |
Research of Solder-Paste Printing Process |
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| Xian Fei. Research of Solder-Paste Printing Process[J]. Printed Circuit Information, 2007, 0(8): 55-63 |
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| Authors: | Xian Fei |
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| Abstract: | Solder-paste printing plays an important part in SMT production, and affects the quality of assemblies. The article introduces many factors of infecting quality in Solder-paste printing process and have analyzed those reasons, presents some corrective actions and advice at the same time, and moreover, this paper simply introduces the theory and the application of solder-paste height inspection, indicates that 3D AOI inspection is necessary method to guarantee the quality of electronics assembly. At last, the article expounds the future development of solder paste printing process. |
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| Keywords: | solder-paste stencil printing SMT defect inspection |
| 本文献已被 CNKI 维普 万方数据 等数据库收录！ |
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