| 超大规模红外器件混成互连的新设备与新方法 |
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| 引用本文： | 谢珩,张毓捷,王宪谋.超大规模红外器件混成互连的新设备与新方法[J].激光与红外,2013,43(9):1048-1050. |
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| 作者姓名： | 谢珩 张毓捷 王宪谋 |
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| 作者单位： | 华北光电技术研究所,北京,100015 |
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| 摘 要： | 介绍了红外探测器与读出电路倒装互连工艺过程,详细对比倒装焊接机FC150和FC300的主要技术参数和功能,着重讨论了FC300新增加的自适应调平系统和干涉仪系统.回顾了法国LETI实验室应用自适应调平系统进行的2K×2K超大规模红外器件混成实验和干涉仪系统在超大规模红外器件倒装互连方面的应用.
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| 关 键 词： | 倒装互连 FC300 自适应调平系统 干涉仪系统 |
New flip chip equipment and its application for large IRFPAs interconnection |
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| XIE Heng,ZHANG Yu-jie,WANG Xian-mou.New flip chip equipment and its application for large IRFPAs interconnection[J].Laser & Infrared,2013,43(9):1048-1050. |
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| Authors: | XIE Heng ZHANG Yu-jie WANG Xian-mou |
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| Affiliation: | North China Research Institute of Electro-optics,Beijing 100015,China |
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| Abstract: | The flip chip process of IRFPAs is introduced and the major parameters of FC300&FC150 are compared. In contrast with FC150, FC300 have higher accuracy and more functions. 2K×2K large format IRFPAs interconnection experiments made by using selflevelling in LETI lab and interferometer system in large IRFPAs applications are reviewed. |
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| Keywords: | flip chip FC300 selflevelling interferometer |
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