| 环氧塑封料的工艺选择及可靠性分析 |
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| 引用本文： | 黄道生. 环氧塑封料的工艺选择及可靠性分析[J]. 电子与封装, 2006, 6(8): 10-11,17 |
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| 作者姓名： | 黄道生 |
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| 作者单位： | 汉高华威电子有限公司,江苏,连云港,222006 |
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| 摘 要： | 文章主要介绍了封装过程中的几个重要工艺参数,分别探讨了不同的工艺条件对环氧塑封料成型工艺的影响,并介绍了封装过程中的工艺调整方向。同时介绍了在环氧塑封料的选择中必须考虑的几个重要因素,并论述了这几个因素对封装器件可靠性造成的影响。
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| 关 键 词： | 环氧塑封料 封装 内应力 流动性 |
| 文章编号： | 1681-1070（2006）08-0010-02 |
| 收稿时间： | 2005-11-16 |
| 修稿时间： | 2005-11-16 |
Epoxy Molding Compound Technology Selection and Reliability Analysis |
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| HUANG Dao-sheng. Epoxy Molding Compound Technology Selection and Reliability Analysis[J]. Electronics & Packaging, 2006, 6(8): 10-11,17 |
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| Authors: | HUANG Dao-sheng |
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| Affiliation: | Henkel Huawei Electronics Co., Ltd. Lianyungang 222006, China |
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| Abstract: | In this paper, mainly introduce a few important technology parameters, and discuss the effection of the technology condition in the process of molding. At the same time we must think over a few factors of EMC, such as moisture absorption, stress and flowing, which can effect the reliability of device |
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| Keywords: | epoxy molding compound (EMC) encapsulation stress flowing |
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