适用于IGBT串联系统集成的驱动电路

为了减少电力电子装置的体积和重量,提高功率密度和变换效率,且避免器件高频工作时,驱动线路寄生参数引起的电磁干扰（EMI）问题,最大限度地提高装置的性能和可靠性,有必要将绝缘栅极双极型晶体管（IGBT）串联驱动电路集成到芯片级的串联模块当中,并实现标准化大规模生产.通过对现有IGBT串联驱动辅助电源拓扑的归纳总结和横向比较表明：在体积、价格和结构复杂程度上,非隔离型的IGBT串联驱动辅助电源均较隔离型的IGBT串联驱动辅助电源有较大优势,因而认为其更适合集成化的串联系统,并在此基础上针对性地提出了自举型驱动辅助电源拓扑,并给出了关键参数的设计方法和可能存在的技术问题及解决方案，这有利于器件（IGBT）串联技术能更有效地应用到中高压、大功率变换装置的工程实践.

Integrated driving circuit of IGBT series connected system

Comparing the existing IGBT driver circuit topologies, it concludes that the non-isolated IGBT driver is more suitable for integrated circuit than the isolated IGBT driver on the volume, cost and topology complexity. A novel driving auxiliary power supply topology was proposed.This circuit can bootstrap power level by level, but the duty cycle and the turn-on period will be limited by the input and output capacitance. It is necessary to estimate the electric charge of driving circuit and then to calculate the critical parameters, such as input and output capacitance. In addition, the bootstrap driving auxiliary power supply may make the protection circuit malfunction when energy needs to bootstrap up through the IGBT. This issue can be resolved through two different scenarios. So this topology makes the technology of IGBT series connection more efficient and possible to be used in the area of the high-voltage, high power power conversion.