负偏压对Be上磁控溅射离子镀Al膜结构影响的研究

以Be为基体，采用磁控溅射离子镀的在其上镀制Al膜，研究了负偏压对Al膜微结构的影响；研究表明，不加基体负偏压，Al膜在（111）面择优生长；随着基体负偏压升高Al膜在（111）面择优生长趋势减北，Al膜在（200）面生长趋势加强；当基体负偏压超过150V后，Al膜在（111）面择优生长的趋势又得到加强。晶粒在低负偏压时随负偏压增加而细化，当较高的负偏压引起基体温度升高时，此时晶粒又变大了。

Study of effect of bias voltage on Al coating microstructure deposited by magnetron sputtering ion plating on beryllium substrate

Magnetron sputtering ion plating has been used to make aluminium coating on beryllium substrate. Effect of bias voltage on morphology, crystallographic orientation and grain size of Al Coating has ban studied. The results show that Al coating grows largely in (111) crystallographic orientation and grain size is much larger when bias voltage is 0 V; Al coating bigins to grow in crystallographic randomness and grain size decreases with bias voltage increasing, if bias voltage is up to 150 V, Al coating grows again largely in (111) crystallographic orientation and grain size increases again with bias voltage increasing.