无铅纯锡电镀中的若干问题

由于纯锡镀层具有许多优良的性质,如可焊性、延展性、导电性和耐蚀性等,因而纯锡已成为电子工业中无铅电镀的首选.但纯锡电镀中存在着许多问题,如锡晶须、镀层变色及镀液混浊等.这些问题对工业电子电镀过程来说是非常重要的,但目前对它们的了解还不多.通过对这些问题进行较深入的研究,找到了镀层变色及镀液混浊的影响因素,给出了三种解决变色问题的方法:电镀添加剂、后处理及Ni(P)阻挡层.开发了一种新的镀锡抗氧化剂.

Some Problems in Lead- free Pure Tin Plating Process

Pure tin is an important choice for lead-free electroplating in electronics industry,because tin electrodeposits provide desirable properties,such as solderability,ductility,electrical conductivity,and corrosion resistance.However,it suffers from some problems such as tin whisker,surface color changes and bath mudding.They are technologically important problem to the electronics plating industry.The knowledge of the problems is not enough now.Thus,many studies have been made.Some influencing factors have been found to the discoloration and bath mudding.Three methods have found to reduce the discoloration: plating additive,post-treatment and Ni(P) underplate.A new antioxidant additive for tin plating has been developed.