| 高密度封装技术推动测试技术发展 |
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| 引用本文： | 鲜飞. 高密度封装技术推动测试技术发展[J]. 电子工业专用设备, 2008, 37(2): 32-35 |
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| 作者姓名： | 鲜飞 |
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| 作者单位： | 烽火通信科技股份有限公司,湖北,武汉,430074 |
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| 摘 要： | 高密度封装技术的飞速发展也给测试技术提出了新挑战。为了应对挑战,新的测试技术不断涌现。对几种新型测试技术的特点及未来测试技术的发展趋势进行了初步分析。
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| 关 键 词： | 集成电路 封装 测试技术 自动光学检测技术 自动X-射线检测 |
| 文章编号： | 1004-4507（2008）02-0032-04 |
| 收稿时间： | 2008-01-08 |
| 修稿时间： | 2008-01-08 |
Testing Technology Development Promoted by HDI Packaging Technology |
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| XLAN Fei. Testing Technology Development Promoted by HDI Packaging Technology[J]. Equipment for Electronic Products Marufacturing, 2008, 37(2): 32-35 |
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| Authors: | XLAN Fei |
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| Abstract: | The rapid development of high density packaging technology has brought new challenges to testing technology. For replying challenge, new testing technologies are developed. Characteristics of several advanced testing technology are introduced in the paper. The up-to-date trends are discussed and the future research directions are suggested. |
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| Keywords: | IC Package Testing Technology AOI AXI |
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