| 新型Sn-Ag-Bi-Cu-In系无铅钎料合金研究 |
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| 引用本文： | 杨志,孙勇,袁宜耀. 新型Sn-Ag-Bi-Cu-In系无铅钎料合金研究[J]. 电子工艺技术, 2006, 27(2): 73-77 |
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| 作者姓名： | 杨志 孙勇 袁宜耀 |
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| 作者单位： | 昆明理工大学;昆明理工大学 |
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| 摘 要： | 通过正交试验设计形成Sn-Ag-Bi-Cu-In系无铅钎料合金,并对钎料合金的熔化温度、可焊性、密度及剪切强度等进行研究.研究发现,Sn-Ag-Bi-Cu-In系钎料合金熔化温度接近传统的熔化温度,固-液温度差小;钎料密度约为传统Sn63Pb37的87%;试样铺展面积为72.02mm2,与Sn63Pb37焊锡的铺展面积76.85 mm2非常接近;钎料的剪切强度远大于传统Sn63Pb37钎料的剪切强度,其断裂形貌为沿晶脆断.
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| 关 键 词： | Sn-Ag-Bi-Cu-In 无铅钎料 熔化温度 剪切强度 |
| 文章编号： | 1001-3474（2006）02-0073-05 |
| 收稿时间： | 2006-02-18 |
| 修稿时间： | 2006-02-18 |
Study of New - type Sn - Ag - Bi - Cu - In Lead - free Solders |
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| YANG Zhi,SUN Yong,YUAN Yi-yao. Study of New - type Sn - Ag - Bi - Cu - In Lead - free Solders[J]. Electronics Process Technology, 2006, 27(2): 73-77 |
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| Authors: | YANG Zhi SUN Yong YUAN Yi-yao |
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| Affiliation: | 1. Kunming University of Science and Technology,Kunming 650093, China; 2. Key Laboratory of Advanced Materials of Yunnan Province, Kunming 650093, China |
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| Abstract: | The composition of Sn-Ag-Bi-Cu-In lead-free solders were studied,through orthogonal design experiment method.In addition,melting temperature,solderability density,shear strength were analyzed.The results show that,melting temperature of Sn-Ag-Bi-Cu-In lead-free solders and Sn63Pb37solder are very close,and melting range is small.The density of solders are about 87percent of traditional Sn63Pb37.The spread area of sample is 72.02 mm~2,approaching 76.85 mm~2 of the spread area of Sn63Pb37solder.The shear strength is higher than traditional Sn63Pb37.And the fracture surface of solder is around grain boundary. |
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| Keywords: | Sn-Ag-Bi-Cu-In |
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