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| 应用电解镀层消除铜材复合界面及其有限元分析 | |
| 引用本文： | 阚志,陈君若,王胜民,李自良. 应用电解镀层消除铜材复合界面及其有限元分析[J]. 机电产品开发与创新, 2007, 20(1): 30-32 |
| 作者姓名： | 阚志 陈君若 王胜民 李自良 |
| 作者单位： | 昆明理工大学,机电工程学院,云南,昆明,650093;昆明理工大学,机电工程学院,云南,昆明,650093;昆明理工大学,机电工程学院,云南,昆明,650093;昆明理工大学,机电工程学院,云南,昆明,650093 |
| 摘 要： | 控制电解沉积过程在纯铜的表面制得宏观上致密、光滑的铜镀层,以此镀层来消除叠轧金属层间的复合界面;对此镀层消除叠轧金属层间复合界面的机理进行初步的分析;并应用有限元软件对轧制过程进行计算机模拟分析,验证提出的机理;得出镀层材料塑性变形程度大,有利于消除金属层间复合界面;镀层不引起界面处塑性变形热效应的明显变化. |
| 关 键 词： | 电解沉积 复合界面 叠轧 有限元法 |
| 文章编号： | 1002-6673（2007）01-030-03 |
| 收稿时间： | 2006-11-28 |
| 修稿时间： | 2006-11-28 |
Apply Electrodeposited Coating to Eliminate Compounded Interface of Copper and Finite Element Analysis |
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| KAN Zhi,CHEN Jun-Ruo,WANG Sheng-Min,LI Zi-Liang. Apply Electrodeposited Coating to Eliminate Compounded Interface of Copper and Finite Element Analysis[J]. Development & Innovation of Machinery & Electrical Products, 2007, 20(1): 30-32 | |
| Authors: | KAN Zhi CHEN Jun-Ruo WANG Sheng-Min LI Zi-Liang |
| Affiliation: | Faculty of Mechanical and Electrical Engineering, Kunming University of Science and Technology, Kunming Yunnan 650093, China |
| Abstract: | Electrodeposited coating is compact and smooth in general that is maken by controlling the processor of electrolysis on surface of pure copper.The Electrodeposited coating can eliminate the compounded interface of accumulative roll-bonding;the paper gives a elementary analysis of the theory about the compounded processor.The result given by finite element analysis prove that the theory analysis is true.The conclusion includes tow items:The first ,Distortion of Electrodeposited coating metal is bigger than work hardening metal;The second , Electrodeposited coating metal does not make the thermo-effect of plastic deformation to change remarkably on the interface. |
| Keywords: | electrodeposited coating compounded interface accumulative roll-bonding finite element analysis |
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