| 高密度高性能电子封装技术 |
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| 引用本文： | 刘文俊. 高密度高性能电子封装技术[J]. 微电子技术, 1998, 0(2) |
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| 作者姓名： | 刘文俊 |
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| 作者单位： | 中国华晶电子集团公司技术支援中心!无锡，214061 |
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| 摘 要： | 本文简要概述了电子封装的发展过程及其结构形式，全面系统地介绍了近几年国外高密度高性能电子封装的最新进展，对当前电子封装的国际发展水平作一综述。
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| 关 键 词： | 高密度封装 芯片互连 表面安装 系统集成 KGD |
High Density and High Performance Electronic Package Technology |
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| Liu Wen jun. High Density and High Performance Electronic Package Technology[J]. Microelectronic Technology, 1998, 0(2) |
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| Authors: | Liu Wen jun |
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| Abstract: | ?In this paper, the development process of the electronic packages and theirformed structures are brielly described. The progress for the development of the highdensity and high performance electronic packages in recent years is introduced compre-hensively and systematically. The state-of arts for the electronic packages in the worldare reviewed. |
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| Keywords: | High densitypackage Chip interconnection Surface mounting System integrating KGD |
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