| 无铅焊膏中松香含量对焊点剪切强度的影响 |
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| 引用本文： | 李国伟,雷永平,夏志东,史耀武,周永馨. 无铅焊膏中松香含量对焊点剪切强度的影响[J]. 电子元件与材料, 2008, 27(5): 65-67 |
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| 作者姓名： | 李国伟 雷永平 夏志东 史耀武 周永馨 |
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| 作者单位： | 北京工业大学,材料学院先进电子连接材料试验室,北京,100022;北京工业大学,材料学院先进电子连接材料试验室,北京,100022;北京工业大学,材料学院先进电子连接材料试验室,北京,100022;北京工业大学,材料学院先进电子连接材料试验室,北京,100022;北京工业大学,材料学院先进电子连接材料试验室,北京,100022 |
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| 基金项目： | 国家科技支撑重点项目 , 北京市属高等学校人才强教计划 , 高等学校博士学科点专项科研项目 |
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| 摘 要： | 对不同松香含量的助焊剂进行了润湿力性能测试和黏度测试。用这些助焊剂配制成焊膏,并对焊后的焊点进行了剪切试验,以此来测定不同的松香含量下焊点的剪切强度。结果表明:焊膏的黏度随着松香含量的增加而增加,而其润湿力逐渐降低。当松香的质量分数为42.69%时,焊点的剪切强度可达48.36MPa,焊膏焊接性能良好,焊点饱满光亮。
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| 关 键 词： | 电子技术 无铅焊膏 松香含量 剪切强度 润湿力 黏度 |
| 文章编号： | 1001-2028(2008)05-0065-03 |
| 修稿时间： | 2008-01-09 |
Effect of rosin contents of lead-free solder paste on the shearing strength of the weld spot |
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| LI Guo-wei,LEI Yong-ping,XIA Zhi-dong,SHI Yao-wu,ZHOU Yong-xin. Effect of rosin contents of lead-free solder paste on the shearing strength of the weld spot[J]. Electronic Components & Materials, 2008, 27(5): 65-67 |
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| Authors: | LI Guo-wei LEI Yong-ping XIA Zhi-dong SHI Yao-wu ZHOU Yong-xin |
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| Affiliation: | LI Guo-wei,LEI Yong-ping,XIA Zhi-dong,SHI Yao-wu,ZHOU Yong-xin (Laboratory of Advanced Electronic Joining Materials,Beijing University of Technology,Beijing 100022,China) |
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| Abstract: | The wetting power and viscosity of fluxes of different rosin contents were tested. The weld spot of solder pastes which were mixed with different rosin contents were tested by shearing strength tests. The results show that the viscosity of the solder paste is enhanced as the rosin contents is increased, but the wetting power is reduced. The shearing strength is 48.36 MPa when w(rosin) is 42.69%, the solder paste has good welding performance and the weld spot is bright and fulllness. |
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| Keywords: | electron technology lead-free solder paster rosin content shearing strength wetting power viscosity |
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